产品用途
该设备适用于指纹识别模组,指纹识别芯片,摄像头模组,FPC挠性电路板,软硬结合板,PCB线路板,多层板,PI、FR4、电磁膜、覆盖膜等辅助材料切割、钻孔、开窗、开盖等。
· This equipment issuitable for auxiliary materials cutting, drilling, open the window and opening.Such as fingerprint identification module, fingerprintidentification chip, camera module, FPC flexible circuit board, soft and rigidcombination board, PCB circuit board, multilayer boards, PI, FR4,electromagnetic film and covering film.
设备图片:
产品特性:
1. 核心部件采用进口全球领导品牌Spectra-Physics紫外激光器。
Core parts adopt imported globalleadership brand - Spectra Physics UV laser.
2. 高精度CCD自动定位,多标靶任意设定。
High precision CCD automaticpositioning, multiple target set arbitrary.
3. 采用大理石底座,高精密全闭环交流直线电机两轴运动平台,精度高,速度快,真空吸附平台方便快捷。
Using the marble pedestal, high precisionclosed loop ac linear motor and two axis motion platform. High precision, fast,vac-sorb platform quickly and easily.
4. 采用固定光路设计,稳定性高。
Adopt fixed optical path design,high stability.
5. 进口紫外激光切割头,高效,品质,精度,可同时加工不同的厚度的FPC材料。
Import UV laser cutting head, efficiency,quality, accuracy. It can processing of different thickness of FPC materials atthe same time.
6. 专用开发切割软件,人性化操作界面,简单易学。
Special cutting software,humanized operation interface. It’s easy to learn.
7. 专用的环保集尘过滤系统。
Special environmental protectiondust filtering system.
8. 与传统加工方式相比,节省开模时间、无机械应力加工。采用激光加工精度高、品质效果好、维护成本低。为用户提高生产效率,节省生产周期,节约生产成本。
Compared with the traditionalprocessing way,it can save the opening time of mould andwithout mechanical stress machining. Using laser processing, the products arehigh precision, good quality effect, and low maintenance cost. For users toimprove production efficiency, saves the production cycle and save the cost ofproduction.
应用实例:
规格参数:
序列号 | 项目 | 规格 |
1 | 激光机主体尺寸 (Laser main part size) | 1750mm(L)*1350mm(W)*1600mm(H) |
2 | 激光机重量 (Weight) | 2000KG |
3 | AC220V | |
4 | 激光器功率(Power) | 进口全固态UV激光器 10W/12W/15W Import all solid state UV laser 10W/12W/15W |
5 | 355nm | |
6 | ≤1.0mm | |
7 | ±20um | |
8 | 平台定位精度(Platform positioning accuracy) | ±5um |
9 | 平台重复精度(Platform repeat precision) | ±2um |
10 | 切割幅面 (Cutting width) | 500*500 |
11 | 设备最大功率(Maximum power) | 5KW |
12 | 振镜(Galvanometer) | · 美国进口(America) |
13 | · 德国进口(Germany) | |
14 | 扩束镜(Beam Expanders) | |
15 | 集尘系统(Integration system) | 汇乐(HuiLe) |
16 | 聚焦光斑(Focusing laser) | 20±5um |
17 | 环境温度/湿度(Temperature/Humidity) | 20°±2°/<60% |
18 | 机床设备主体(Base) | 大理石 Marble |
19 | 伺服运动驱动器(servo drives) | 高创(Servotronix) |
20 | THK (THK) | |
21 | 雷尼绍(Renishaw) | |
22 | 兼容文件格式(Compatible format) | Gerber,Dxf |
23 | 操作软件(Operational software) | 自主开发Autonomous development |
24 | 运动系统(Moving system) | 全闭环交流直线电机Closed loop ac linear motor |